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Joint M.S. & Ph.D. Candidate, Electrical & Electronic Engineering
Yonsei University (BLISS Lab) 2022–present PI: Prof. Jungmok Seo -
B.S., Electronic Engineering (Major) · Life Science (Minor)
Ewha Womans University 2015–2022
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Visiting Researcher, Harvard Medical School
Brigham and Women's Hospital · Shin Lab 2025.02–2026.02 BK21 International Joint Research Program
- 2024 GCIM IUMRS-ICYRAM Young Researcher Award
- 하이드로겔 기반 기술이전 2건
Functional Hydrogel
Designing multi-functional hydrogels that are self-healing, tissue-conformable, and stimuli-responsive — from tough wound-care dressings and hemostatic scaffolds to 3D-printed soft electronics and anti-fouling implantable interfaces.
Soft Electronics
Building stretchable and flexible bioelectronic systems — electrochemical biosensors with tunable diffusion interfaces, electrical stimulation patches for wound healing, and liquid-based conductors for long-term wearable and implantable devices.
Paper accepted in Advanced Healthcare Materials (co-first author)
Soo A Kim* and Jung Hyun Kim* optimized electrical stimulation parameters using a spray-printed conductive electroceutical (SCOPE) patch for accelerated wound healing in diabetic mice.
PublicationPaper accepted in Advanced Materials (co-first author)
Ion-mediated structural engineering of hydrogel interfaces for tunable mechanical and analyte diffusion properties — a new platform for electrochemical biosensors.
PublicationVisiting researcher at Harvard Medical School / Brigham and Women's Hospital
Commenced BK21 international joint research at the Shin Lab (BWH, HMS), focusing on biomaterials at the biology–device interface. Research period: 2025.02 – 2026.02.
Research2024 GCIM IUMRS-ICYRAM Young Researcher Award
Received the Young Researcher Award at the 6th International Conference of Young Researchers on Advanced Materials (ICYRAM 2024) / Global Conference on Innovation Materials (GCIM 2024), Jeju Island, Korea.
AwardFirst-author paper published in International Journal of Bioprinting
3D printing of mechanically tough and self-healing hydrogels with carbon nanotube fillers — Kim S.A. as first author.
PublicationLet's build something at the interface.
Open to collaborations across sensing, soft materials, and translational devices — and always happy to talk science.